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Fireside Chat
Tuesday Oct 25, 2011
5:00 pm – 6:00 pm
Cadence and ARM Fireside Chat
Collaboration has become an essential ingredient of product innovation for even the largest companies – and especially for the fastest-moving. New technologies and opportunities are driving deeper relationships between companies up and down the ecosystem. Listen to this informal conversation between Simon Segars of ARM and Lip-Bu Tan of Cadence as they discuss how collaboration is evolving and what’s necessary for success in the era of “apps-driven” multicore designs and 20nm implementation. Get an executive perspective on how to evaluate innovation opportunities and how to drive effective collaboration to capitalize on those opportunities.
Hosted by LIP-BU TAN
President and Chief Executive Officer
Cadence Design Systems, Inc.
Lip-Bu Tan is President and Chief Executive Officer of Cadence® Design Systems, Inc. He has been a member of the Cadence Board of Directors since 2004 and serves as a member of the Finance and Technology Committees of the Board. He also serves as chairman of Walden International, a venture capital firm he founded in 1987. Prior to founding Walden, Tan was Vice President at Chappell & Co. and held management positions at EDS Nuclear and ECHO Energy.
Tan received an M.S. in nuclear engineering from the Massachusetts Institute of Technology, an MBA from the University of San Francisco, and a B.S. from Nanyang University in Singapore. He serves on the Board of Directors of both the Electronic Design Automation Consortium (EDAC) and the Global Semiconductor Association (GSA).
SIMON SEGARS
EVP and General Manager Physical IP Division
ARM
Simon Segars joined the board in January 2005 and was appointed EVP and General Manager of the Physical IP Division in September 2007. He has previously been EVP, Engineering, EVP, Worldwide Sales and latterly EVP, Business Development. He joined ARM in early 1991 and has worked on many of the ARM CPU products since then. He led the development of the ARM7 and ARM9 Thumb® families. He holds a number of patents in the field of embedded CPU architectures. He is a member of the SOI Industry Consortium and of the EDA Consortium. |
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